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Materials Thermal Stack Resistance Calculator
x402
Materials Thermal Stack Resistance Calculator is a paid API for AI agents from www.mahastrategies.com, paid per call via x402, $0.043001/call, status unknown (last checked 2026-10-26).
Calculates one-dimensional thermal resistance for a stack of material layers and interfaces given supplied geometry, material, and interface resistance inputs.
Price / call$0.043001
Success—
StatusUnknown
How this service works
Calculate a one-dimensional layer and interface thermal-resistance scenario from supplied inputs. No hotspot, convection, transient or validated package-safety claim.
Output
Returns a structured result object with total and per-layer thermal resistance values, boundary temperature conditions, an offer ID, version, input digest, receipt digest, and the amount charged in base units. Does not include hotspot analysis, convection effects, transient behavior, or validated package safety claims.
Example use cases
PCB copper-to-heatsink thermal path
“I have a 4-layer stack: solder (0.1mm), copper (0.5mm), thermal pad (0.2mm), aluminum heatsink base (3mm). The two interface resistances are 5e-5 and 1e-4 m²·K/W and the area is 0.001 m². Can you calculate the total 1D thermal resistance using public data?”
Chip package TIM resistance estimate
“Model the thermal resistance of a chip package stack — silicon die (0.5mm), TIM1 (0.1mm), copper lid (2mm) — with interface resistances of 2e-4 and 1.5e-4 m²·K/W across a 0.0009 m² area, synthetic data class, so I can estimate junction-to-case resistance.”
LED module heat spreading layer check
“For an LED module I have three layers: alumina substrate (0.635mm), solder (0.05mm), and copper slug (3mm), with interface resistances 3e-5 and 6e-5 m²·K/W and a 0.0002 m² footprint. Give me the total stack thermal resistance using public data class.”
Technical details
Endpoint
POSThttps://www.mahastrategies.com/api/v1/micro/materials-thermal-stack-resistance?utm_source=zero.xyzWhen to prefer
Choose this endpoint when you need a fast, deterministic, 1D conduction thermal resistance calculation for a known layer stack — e.g. during materials selection, packaging design, or quick feasibility checks. It is not suitable for convective, transient, or 3D spreading analyses, or for certified safety compliance claims. It is best when you have explicit layer geometry, material thermal conductivities, interface resistance values, and area, and want a reproducible per-call result at low cost.
Side effects
- Missing required fields (dataClass, layers, interfaceResistanceM2KPerW, areaM2) returns validation error
- Layer count exceeds 32 or interface array exceeds 31 items returns schema error
- Area outside allowed range (0 to 1e12 m²) returns validation error
- Interface resistance array length does not match layers-minus-one returns computation error
- Invalid dataClass enum value returns validation error
- Payment failure returns HTTP 402 with x402 payment-required response
Input
Schema · Request body
| Field | Type | Description |
|---|---|---|
| inputrequired | object | |
| output | object |
Tags
x402
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